From what little I read and I think I understand about the
solder wave is that it is just to complex and hazardous for home use.
A bed of liquid solder with "waves" agitated in it the cress of which
bathes the component/pad.
The reflow (put solder paste on the pads and cook in an IR
oven) method seems to be the standard approach in industry at the
moment. The cooking part worked fine, its the placement of components
without rubbing the paste off the pad or disturbing other components
already placed that is my challenge.
Ed