X-Virus-Scanned: clean according to Sophos on Logan.com X-SpamCatcher-Score: 2 [X] Return-Path: Received: from vms042pub.verizon.net ([206.46.252.42] verified) by logan.com (CommuniGate Pro SMTP 5.1.6) with ESMTP id 1858151 for flyrotary@lancaironline.net; Fri, 23 Feb 2007 11:43:52 -0500 Received: from [127.0.0.1] ([71.98.190.86]) by vms042.mailsrvcs.net (Sun Java System Messaging Server 6.2-6.01 (built Apr 3 2006)) with ESMTPA id <0JDX00GWBD427RB6@vms042.mailsrvcs.net> for flyrotary@lancaironline.net; Fri, 23 Feb 2007 10:43:19 -0600 (CST) Date: Fri, 23 Feb 2007 11:44:26 -0500 From: Finn Lassen Subject: Re: [FlyRotary] Re: Cooked Board - Really! In-reply-to: To: Rotary motors in aircraft Message-id: <45DF19EA.8000401@verizon.net> MIME-version: 1.0 Content-type: multipart/alternative; boundary=------------050701090707070806090407 References: User-Agent: Thunderbird 1.5.0.9 (Windows/20061207) This is a multi-part message in MIME format. --------------050701090707070806090407 Content-Type: text/plain; charset=ISO-8859-1; format=flowed Content-Transfer-Encoding: 7bit Yes, that was then with all pin-through components. Now we have those awful surface mounted components. Finn Lehanover@aol.com wrote: > In a message dated 2/23/2007 9:22:24 A.M. Eastern Standard Time, > eanderson@carolina.rr.com writes: > > From what little I read and I think I understand about the solder > wave is that it is just to complex and hazardous for home use. A > bed of liquid solder with "waves" agitated in it the cress of > which bathes the component/pad. > > The reflow (put solder paste on the pads and cook in an IR oven) > method seems to be the standard approach in industry at the > moment. The cooking part worked fine, its the placement of > components without rubbing the paste off the pad or disturbing > other components already placed that is my challenge. > > Ed > > At Western Electric there were dozens of wave machines at the end of > each circuit board line. Machines with belted devices inserted the > devices, cut the leads to length and crimped the leads over the solder > pad at the rate of a very fast machine gun. And that was in the 60s. > > Diodes, resistors and transistors went on this way. Other machines > could add ICs and multiple lead devices in a similar way. I should > have paid more attention. > > Lynn E. Hanover > > > > ------------------------------------------------------------------------ > AOL now offers free email to everyone. Find out more about what's free > from AOL at *AOL.com* > . --------------050701090707070806090407 Content-Type: text/html; charset=ISO-8859-1 Content-Transfer-Encoding: 7bit Yes, that was then with all pin-through components. Now we have those awful surface mounted components.

Finn

Lehanover@aol.com wrote:

In a message dated 2/23/2007 9:22:24 A.M. Eastern Standard Time, eanderson@carolina.rr.com writes:

From what little I read and I think I understand about the solder wave is that it is just to complex and hazardous for home use. A bed of liquid solder with "waves" agitated in it the cress of which bathes the component/pad.

The reflow (put solder paste on the pads and cook in an IR oven) method seems to be the standard approach in industry at the moment. The cooking part worked fine, its the placement of components without rubbing the paste off the pad or disturbing other components already placed that is my challenge.

Ed

At Western Electric there were dozens of wave machines at the end of each circuit board line. Machines with belted devices inserted the devices, cut the leads to length and crimped the leads over the solder pad at the rate of a very fast machine gun. And that was in the 60s.

Diodes, resistors and transistors went on this way. Other machines could add ICs and multiple lead devices in a similar way. I should have paid more attention.

Lynn E. Hanover

AOL now offers free email to everyone. Find out more about what's free from AOL at AOL.com.

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