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Finn Lassen wrote:
Yes, that was then with all pin-through components. Now we have those awful surface mounted components.
Finn
I spent 4 hellish years standing in a noisy room while AT&T paid me.
The boards would pass through the Fuji machine which strategically placed small dabs of glue, then components. The board was flipped, passed through a screen printing setup just like Ed made (the squegee was a metal blade, though), and then more parts placed. The boards passed down the assembly line to an 'pizza oven'...they passed through on a rotating wire bed. The glued on components had yet to see solder.
The boards were then carted up and passed between seated workers who hand installed leaded components, then passed over a wave solder machine. The wave solder took care of the leaded components and the components glued to the bottom. Sometimes, the glue would let loose, and that accounted for the most board failures.
My job was to test boards at the end of the line with a bed of nails tester.
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,|"|"|, Ernest Christley |
----===<{{(oQo)}}>===---- Dyke Delta Builder |
o| d |o http://ernest.isa-geek.org |
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