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Ed Anderson wrote:
On the first solder run, I had too much pressure and while the area of the solder paste deposit was excellent (even on the 0.25mm socket lands), there was too little quantity of solder to hold the hold the components in position.
The second solder run I used less squeegee pressure and it left (did not scope it out) a large volume of solder (too much in the case of the 0.25mm socket lands and they bridged). Solder wick may be able to get the excess solder out.
Wick will work if you use lots of flux.
I used to solder these high lead count devices on by hand. The technique was to tack down a couple corners, drown the thing in flux, then just run the iron and the solder down each side as if you were brazing. You have to move fast, but when you lay down the correct amount of solder it would wick up the leads and not leave enough to bridge.
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,|"|"|, Ernest Christley |
----===<{{(oQo)}}>===---- Dyke Delta Builder |
o| d |o http://ernest.isa-geek.org |
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